| 发明名称 |
IC TILING PATTERN METHOD, IC SO FORMED AND ANALYSIS METHOD |
| 摘要 |
The invention provides a method for providing an integrated circuit ( 6 ) having a substantially uniform density between parts ( 10, 12, 14 and 16 ) of the IC that are non-orthogonally angled. In particular, the invention provides fill tiling patterns ( 32, 34 ) oriented substantially parallel to electrical structure regardless of their angle. A method of electrical analysis based on this provision is also provided as is a related program product.
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| 申请公布号 |
US2005273744(A1) |
申请公布日期 |
2005.12.08 |
| 申请号 |
US20050160339 |
申请日期 |
2005.06.20 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ALLEN ROBERT J.;COHN JOHN M.;HABITZ PETER A.;LEIPOLD WILLIAM;WEMPLE IVAN;ZUCHOWSKI PAUL S. |
| 分类号 |
G06F9/45;G06F13/00;G06F17/50;H01L21/321;H01L23/48;H01L23/52;H01L23/528;H01L23/535;H01L27/02;(IPC1-7):G06F9/45 |
主分类号 |
G06F9/45 |
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