| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated substrate which facilitates manufacture and stabilizes electrical, mechanical characteristics of an interlayer connection and a method of manufacturing the same, and to provide an electronic apparatus having such laminated substrate. SOLUTION: The laminated substrate includes a core layer which functions as a printed circuit board, a build up layer having an edge and a wiring and electrically connected to the core layer, and a bonding layer which connects and pastes electrically the core layer and the build up layer. The bonding layer contains a thing which made adhesive containing what performed solder plating having a second melting point lower than a first melting point on the front surface of metal particles as a filler having the first melting point. COPYRIGHT: (C)2006,JPO&NCIPI |
