| 摘要 |
PROBLEM TO BE SOLVED: To provide an etching apparatus for uniformizing the flow rate of an etching solution, and to provide a method for manufacturing a circuit board using it. SOLUTION: The etching apparatus has a body of which the inside is separated into a first space and a second space by a partition wall, and an inlet for making the etching solution flow into the first space, wherein the partition wall has a first outlet for communicating the first space with the second space formed therein, and the outer wall of the body has a plurality of the second outlets for communicating the second space with the outside of the body formed therein, so that when the etching solution having flowed into the first space flows out through the first outlet into the second space, temporarily passes through it, and then spouts out into the outside of the body through the second outlet, the flow rate of the etching solutions which spout out through each second outlet can be equalized. COPYRIGHT: (C)2006,JPO&NCIPI
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