GOLD PLATING AFTER HEAT TREATMENT

摘要

PROBLEM TO BE SOLVED: To improve the solder wettability because the soldering work is required to bond electrodes by solving a problem that a gold-plated wafer is heat-treated and soldering is performed after the heat treatment in order to improve adhesiveness of aluminum and aluminum-silicon alloy to nickel plating, and the solder wettability is considerably degraded after the heat treatment. SOLUTION: To improve the adhesiveness of aluminum and aluminum-silicon alloy to nickel plating, the solder wettability is improved by performing displacement gold plating after the heat treatment of a gold-plated wafer. COPYRIGHT: (C)2006,JPO&NCIPI