| 摘要 |
PROBLEM TO BE SOLVED: To surely remove a mounted component from a substrate without uselessly heating the mounted component, the substrate, etc. SOLUTION: A mounted component removing tool 1 for removing the mounted component 4 soldered on the substrate 6 by a plurality of terminals 5 projecting from both side faces of the mounted component 4 from the substrate 6 comprises wedge-like ends 7 so formed at the end of a soldering iron as to be inserted between each terminal 5 and the substrate 6; a concave portion 9 which is formed at the tip of each wedge-like end 7, and with which the terminal 5 is to be engaged; and a pressing portion 3 for pressing the mounted component 4, in such a direction that each terminal 5 may be pressed against a slanted surface 8 of each wedge-like end 7. COPYRIGHT: (C)2006,JPO&NCIPI |
