| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board for transferring heat between layers without generating the non-uniformity of thermal distribution in a cure process. <P>SOLUTION: In a method for manufacturing a printed wiring board having a process to pressurize and heat a printed wiring board 24 on which a plurality of layers are laminated by interposing it by metallic plates 23, the printed wiring board 24 is pressurized and heated in a status that the metallic plates 23 are connected so that heat can be transferred by heat transmitting materials 31. Thus, each metallic board 23 is quickly heated so that the non-uniformity of thermal distribution can be canceled, and that the time of the cure process can be also shortened. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
