| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing semiconductor having characteristics excellent in reliability in operation at high temperature and to provide a semiconductor device obtained by sealing a semiconductor element using the composition. SOLUTION: The invention relates to the epoxy resin composition for sealing semiconductor device comprising (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) an aluminum compound as essential component, wherein the content of aluminum element in the total epoxy resin composition is 0.25-5 wt.%. COPYRIGHT: (C)2006,JPO&NCIPI
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