| 摘要 |
PROBLEM TO BE SOLVED: To reduce manufacturing cost by eliminating the need for a foundation processing, a wiring or the like at a time, when a temperature sensor is mounted on an imaging device. SOLUTION: The image sensing device has a CCD, a Peltier element cooling the CCD, and a flexible board 20 electrically connected to an electrode for the CCD and used for electrical connections with an external device. A temperature sensor 21 detecting the temperature of the CCD is arranged near an electrode mounting section 20B on the flexible board 20, on which the electrode for the CCD is mounted. COPYRIGHT: (C)2006,JPO&NCIPI
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