A substrate plate (2) has an opening (3) to take a carrier chip (4) with electrical/electronic components (5). Integrated in the carrier chip are conductor strips (7) connecting the components to electrical connection contacts (8). There is a sealing between the substrate plate and the carrier chip. The cross section of one projecting end (10) tapers from the substrate plate's surface (9) towards the point on this projecting end that juts out furthest.
