| 摘要 |
A CCD unit (3) is formed on the front side of a semiconductor substrate (1). A region in the backside of the semiconductor substrate (1) corresponding to the CCD unit (3) is thinned while leaving a peripheral region (1a) around the above-mentioned region intact, and an accumulation layer (5) is formed over the backside of the semiconductor substrate (1). An electric wiring (7) electrically connected to the CCD unit (3) and an electrode pad (9) electrically connected to the electric wiring (7) are then formed on a region (1b) in the front side of the semiconductor substrate (1) which corresponds to the peripheral region (1a). Next, a supporting substrate (11) is adhered to the front side of the substrate (1) so that the CCD unit (3) is covered with the supporting substrate (11) but the electrode pad (9) is exposed. Then, the semiconductor substrate (1) and the supporting substrate (11) are cut at a position in the thinned portion of the semiconductor substrate (1) so that a part of the peripheral region (1a) corresponding to the region (1b) on which the electric wiring (7) and the electrode pad (9) are formed remains after cutting. |
