发明名称 |
Marking semiconductor devices through a mount tape |
摘要 |
Wafer level techniques for marking the back surfaces of integrated circuit devices are described. The back surface of the wafer is laser marked while being supported by a mount tape. In some embodiments, the mount tape is sufficiently transparent that the laser light passes through the mount tape and marks the back surface of the wafer. In other embodiments, the laser may actually burn the mounting tape (or portions thereof) during the marking process. The marking may be done on any suitable back surface material including polymeric backcoatings, metalized films or directly on semiconductor materials.
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申请公布号 |
US6972244(B1) |
申请公布日期 |
2005.12.06 |
申请号 |
US20040831390 |
申请日期 |
2004.04.23 |
申请人 |
NATIONAL SEMICONDUCTOR CORPORATION |
发明人 |
PATWARDHAN VIRAJ A.;KELKAR NIKHIL VISHWANATH;HOW YOU CHYE;GOH TIAN OON;LOW SOI CHONG |
分类号 |
H01L21/301;H01L21/46;H01L21/68;H01L21/78;H01L23/544;(IPC1-7):H01L21/301 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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