| 摘要 |
PURPOSE: A method for manufacturing and device for PCB equipped with heatproof material is provided to enable users to minimize the size of package while efficiently releasing heat from the package so as to prevent any damage of inner components. CONSTITUTION: A method for manufacturing and device for PCB equipped with heatproof material includes the following components. A metal core(20) is set inside the PCB(10). Heat is exhausted through the lower part of a package which is generated from a chip of a package. A conduction paste(36) is charged and attached so as to actively release the heat aroused from the chip. The device enables users to minimize the size of package and easily design the device. |
