| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve vibration-proof properties of a sensor chip, and to relax thermal stress caused by an adhesive film, in an angular-velocity sensor, formed by laminating the sensor chip on a circuit chip. <P>SOLUTION: This angular velocity sensor is equipped with the sensor chip 5, having a vibrator driven and vibrated at a prescribed frequency, for detecting an angular velocity applied to the vibrator about a prescribed rotation axis; and the circuit chip 3 arranged being laminated with the sensor chip 5, wherein a circuit for acquiring the angular velocity, based on a signal acquired from the sensor chip 5, is formed. In the sensor, the sensor chip 5 and the circuit chip 3 are bonded together via the adhesive film 4, and at least either of the shape and the elastic modulus of the adhesive film 4 is adjusted so that the resonance frequency of the sensor chip 5 becomes lower than the driving frequency of the vibrator, or preferably that the resonance frequency of the sensor chip 5 becomes smaller than 2<SP>1/2</SP>times the driving frequency of the vibrator. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
