| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible printed wiring board wherein lifting of a bonding interface by heating etc. can be prevented by making coefficient of thermal expansion of an interlayer connection and coefficient of thermal expansion of an insulator almost identical, and reliability of electrical connection is superior, and to provide a method for manufacturing a flexible printed wiring board wherein a flexible printed wiring board excellent in electrical connection reliability can be manufactured easily by few processes, productivity is superior, microfabrication of the conductor pattern of a conductive layer can be attained, and densification of wiring is enabled. SOLUTION: The flexible printed wiring board 1 has constitution wherein the interlayer connection 6 is formed of a complex in which the gap of a compact 7 which is formed by insulation displaced molding of metallic particles 7a is filled with solder 8. The method for manufacturing a flexible printed wiring board has constitution which is provided with a through hole penetrating process, an insulation displaced molding process wherein a through hole is filled with metallic particles and insulation displaced molding is performed, a solder application process which applies solder to the compact, and a solder penetration charge process wherein solder penetration is performed to the gap of the compact. COPYRIGHT: (C)2006,JPO&NCIPI |
