| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board which allows the precise formation of an opening of a metal mask to be used for forming a via hole. SOLUTION: The method of manufacturing the printed wiring board comprises: the process (a) wherein a copper foil with resin is stacked on a basic substrate formed with an inner layer interconnection on the surface, in such a manner that the resin layer of the copper foil may be in contact with the inner layer interconnection; the process (b) wherein the copper foil is removed from the copper foil with resin stacked on the basic substrate to expose the resin layer; the process (c) wherein a first metal layer having a film thickness of 0.5μm or less is formed on the surface of the resin layer exposed in the process (b); the process (d) wherein the opening is formed in a region of the first metal layer corresponding to the inner layer interconnection; and the process (e) wherein, with the first metal layer formed with the opening as a mask, the resin layer is removed to form the via hole wherein the inner layer interconnection is exposed in the bottom face. COPYRIGHT: (C)2006,JPO&NCIPI |
