Manufacturing a light emitting diode group by application to a substrate plate and subsequent sub-division

摘要

In a process to manufacture a light emitting diode (LED) group, a group of LED dies is applied to a plate frame, followed by application of reflecting frames on the plate. The dies are joined to the frame by bonding wired followed by embedding in the frame. The frame is then cut and sub-divided into groups. Also claimed is a suitable light emitting diode group.