发明名称 |
Air gap formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device |
摘要 |
An air gap structure and formation method for substantially reducing the undesired capacitance between adjacent interconnects, metal lines or other features in an integrated circuit device is disclosed. The air gap extends above, and may also additionally extend below, the interconnects desired to be isolated thus minimizing fringing fields between the lines. The integrated air gap structure and formation method can be utilized in conjunction with either damascene or conventional integrated circuit metallization schemes. Also, multiple levels of the integrated air gap structure can be fabricated to accommodate multiple metal levels while always ensuring that physical dielectric layer support is provided to the device structure underlying the interconnects.
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申请公布号 |
US2005263896(A1) |
申请公布日期 |
2005.12.01 |
申请号 |
US20050179840 |
申请日期 |
2005.07.11 |
申请人 |
LUR WATER;LEE DAVID;WANG KUANG-CHIH;YANG MING-SHENG |
发明人 |
LUR WATER;LEE DAVID;WANG KUANG-CHIH;YANG MING-SHENG |
分类号 |
H01L21/768;H01L23/522;(IPC1-7):H01L29/40 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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