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发明名称
A DEVICE FOR BONDING THE DIE IN A SEMICONDUCTOR PACKAGING EQUIPMENT
摘要
申请公布号
KR20050112887(A)
申请公布日期
2005.12.01
申请号
KR20040038324
申请日期
2004.05.28
申请人
HYNIX SEMICONDUCTOR INC.
发明人
KWON, SUN HOO
分类号
H01L21/60;(IPC1-7):H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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