WAFER EXPANDING APPARATUS, COMPONENT SUPPLYING APPARATUS AND WAFER SHEET EXPANDING METHOD

摘要

In a sag removing process wherein a sag generated on a wafer sheet (8) is removed by heat blow, a wafer supplying plate (6w) is positioned at a height position (H2) between a first height position (H3) and a second height position (H1). Thus, a distance (d) between a top edge part (63a) of an expanding ring (63) and a bottom plane of the wafer sheet can be reduced, and efficient and uniform process can be performed. At least at the time of completing the slag removing process, by setting the height position so as to prevent the wafer sheet from abutting on the top edge part of the expanding ring, contraction/expansion of the wafer sheet is surely prevented from being disturbed by the abutment on the top edge part.