发明名称 MULTIPART ELECTRONIC CIRCUIT ASSEMBLY WITH DETACHABLY INTERCONNECTING AND LOCKING COMPONENT CIRCUIT SUBSTRATES
摘要 An assembly of releasably interconnected circuit substrates is provided. T he assembly has a first and second circuit substrate. Each substrate provides a n electrical connector for mating electrical engagement of the first and second substrate s. The assembly also has a two-position lock that is operable between a first and second position. In the first position of the lock, the first and second circuit substrates are in locked interconnection with each other. In the second position of the lock, the first and second circuit substrates are separable from each other.
申请公布号 CA2468551(A1) 申请公布日期 2005.11.27
申请号 CA20042468551 申请日期 2004.05.27
申请人 ALCATEL 发明人 BUNDZA, NICK;LETOURNEAU, FABIEN;CHESHIRE, GREG
分类号 H01R13/639;H04Q1/02;H05K1/14;H05K3/36;H05K7/10;(IPC1-7):H05K1/14 主分类号 H01R13/639
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