发明名称 |
MULTIPART ELECTRONIC CIRCUIT ASSEMBLY WITH DETACHABLY INTERCONNECTING AND LOCKING COMPONENT CIRCUIT SUBSTRATES |
摘要 |
An assembly of releasably interconnected circuit substrates is provided. T he assembly has a first and second circuit substrate. Each substrate provides a n electrical connector for mating electrical engagement of the first and second substrate s. The assembly also has a two-position lock that is operable between a first and second position. In the first position of the lock, the first and second circuit substrates are in locked interconnection with each other. In the second position of the lock, the first and second circuit substrates are separable from each other.
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申请公布号 |
CA2468551(A1) |
申请公布日期 |
2005.11.27 |
申请号 |
CA20042468551 |
申请日期 |
2004.05.27 |
申请人 |
ALCATEL |
发明人 |
BUNDZA, NICK;LETOURNEAU, FABIEN;CHESHIRE, GREG |
分类号 |
H01R13/639;H04Q1/02;H05K1/14;H05K3/36;H05K7/10;(IPC1-7):H05K1/14 |
主分类号 |
H01R13/639 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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