| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which contains a control element and a power element controlled by the control element and has a good heat dissipation characteristic. SOLUTION: This semiconductor device has a heat sink 30 made of Fe inferior to Cu in heat conductivity but superior to Cu in heat storage property; a first wiring board 41; and a second wiring board 42 which have been mounted and separated on one side of this heatsink 30. A control element 10 is mounted on the first wiring board 41 and a power element 20 on the second wiring board 42. These elements 10 and 20, wiring boards 41 and 42 and heatsink 30 are all molded with resin 70, and the other surface of the heatsink 30 are exposed from the resin 70. In addition, a projection 31 is formed at the side of the heatsink and this project 31 encroaches into the resin 70. COPYRIGHT: (C)2006,JPO&NCIPI |
