| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin-film multilayer wiring board high in electric signal transmission speed and in mechanical strength with a pattern thereon processable with high precision. SOLUTION: For the formation of the thin-film multilayer wiring board, at least two wiring layers are formed on either or both sides of a first insulating layer-made inner board with second insulating layers sandwiched between. The first insulating layer 11 is formed of an insulating material having a Young's modulus of≥5,000 MPa and a breaking strength of≥400 MPa. The second insulating layers 51a are formed of insulating materials each having a Young's modulus of≤2,500 MPa, a dielectric constant of≤2.9 at 1 GHz, a dielectric dissipation factor of≤0.01, and a water absorption coefficient of≤0.3%. Each of second insulating layers 51a has a surface roughness Ra of≥0.01μm but≤0.2μm. Side faces of the first insulating layer 11 on the periphery of the thin-film multilayer wiring board is coated with resin 51 comprising the second insulating layers 51a. COPYRIGHT: (C)2006,JPO&NCIPI |
