| 摘要 |
PROBLEM TO BE SOLVED: To provide a CAD system for an electronic circuit board capable of merging vias, and capable of connecting efficiently those to a through hole conductor, as to the via and the through hole conductor constituting a conductive path for an electric power source and for the ground. SOLUTION: This CAD system has an integration via generating means for connecting the same kind of a via pattern and a through hole conductor pattern, by projecting a via integrated wiring pattern and a through hole conductor integrated wiring pattern onto an intermediate layer corresponding to a dielectric layer sandwiched by a wiring layer corresponding to the first wiring layer and a wiring layer corresponding to the second wiring layer, after wiring construction processing, and by generating the via pattern for integration in an intersection of the via integrated wiring pattern with the through hole conductor integrated wiring pattern, of which the projected patterns are the same kind. COPYRIGHT: (C)2006,JPO&NCIPI
|
