| 发明名称 |
Method of incorporating magnetic materials in a semiconductor manufacturing process |
| 摘要 |
A method for incorporating magnetic materials in a semiconductor manufacturing process includes manufacturing a semiconductor device including interlayers and dielectric layers, depositing a magnetic layer above a semiconductor device and forming metallized contacts for connecting interlayers of the semiconductor device. With the method of the present invention, the deposition of the magnetic material is integrated with the semiconductor manufacturing process.
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| 申请公布号 |
US2005260774(A1) |
申请公布日期 |
2005.11.24 |
| 申请号 |
US20050182943 |
申请日期 |
2005.07.18 |
| 申请人 |
BERNDT DALE F;PECZALSKI ANDRZEJ;VOGT ERIC E;WITCRAFT WILLIAM F |
发明人 |
BERNDT DALE F.;PECZALSKI ANDRZEJ;VOGT ERIC E.;WITCRAFT WILLIAM F. |
| 分类号 |
G11C11/14;H01F10/30;H01L21/8246;H01L27/22;(IPC1-7):H01L21/00;G01B7/14;G01B7/30;G01R33/06;H01L43/06 |
主分类号 |
G11C11/14 |
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