发明名称 SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <p>A substrate processing apparatus for continuously processing substrates efficiently performs substrate processing having a return process. The substrate processing apparatus has a conveyance chamber as a conveyance space for substrates, processing chambers in which the substrates are processed, substrate conveyance means provided in the conveyance chamber and having a function of conveying the substrates, and substrate conveyance control means for controlling conveyance of the substrates by the substrate conveyance means. The control by the substrate conveyance control means is made such that, in the execution of a return process in which substrates are continuously processed by two or more processing chambers and then reconveyed for processing to any processing chamber other than the last one of the two or more processing chambers, the substrates are temporarily receded, in the reconveyance, at a place other than the processing chambers and then conveyed to the any processing chamber.</p>
申请公布号 WO2005112108(A1) 申请公布日期 2005.11.24
申请号 WO2005JP09107 申请日期 2005.05.12
申请人 HITACHI KOKUSAI ELECTRIC INC.;TAKANO, SATOSHI 发明人 TAKANO, SATOSHI
分类号 H01L21/02;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/02
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