| 摘要 |
The present ivention includes a method of patterning a conductive layer on an substrate that features creating a multi-layered structure by solidifying a liquid layer to have a pattern including protrusions and recessions, defining a solidified layer. The liquid conformal layer is reflowed to provide a substantially smooth surface before solidification. In one embodiment of the invention, the liquid conformal layer may include a conductive component. By ensuring that the conformal layer forms a smooth, if not, planar surface, control over the dimensions of the resulting features is maintained. As a result, a single level layer of high density multiple conductive elements may be fabricated. |
