发明名称 LIFT-OFF PROCESS FOR GAN FILMS FORMED ON SIC SUBSTRATES AND DEVICES FABRICATED USING THE METHOD
摘要 <p>One embodiment of a method according to the present invention for fabricating a high light extraction photonic device comprises growing a lift-off layer on a substrate and growing an epitaxial semiconductor device structure on the lift-off layer such that the lift-off layer is sandwiched between said device structure and substrate. The epitaxial semiconductor structure comprises an emitter adapted to emit light in response to a bias. The device structure, lift-off layer and substrate is flip-chip mounted on a submount such that the epitaxial semiconductor device structure is sandwiched between the submount and lift-off layer. The lift-off layer is removed to separate the substrate from the device structure. Different removal methods can be used such as removal by a photo electrochemical etch or by illuminating the lift-off layer with laser light.</p>
申请公布号 WO2005112138(A1) 申请公布日期 2005.11.24
申请号 WO2005US09327 申请日期 2005.03.22
申请人 CREE, INC. 发明人 NAKAMURA, SHUJI;DENBAARS, STEVEN
分类号 H01L33/00;H01L33/10;H01L33/46;(IPC1-7):H01L33/00 主分类号 H01L33/00
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