CIRCUIT BOARD AND ELECTRONIC APPARATUS EMPLOYING IT

摘要

Distance P' between the centers of an outermost through hole (4b) and an adjacent through hole (4d) closest thereto is set greater than the distance P between the centers of a central through hole (4a) and an adjacent through hole (4c) closest thereto. Since the quantity of solder filling the side apart from the center of a case increases in the outermost through hole (4b) when an electronic component is mounted, a stress generated when the lead of the electronic component is bent due to difference in thermal expansion coefficient between the electronic component case and a multilayer circuit board (1) during soldering process is absorbed by the solder. Consequently, it is possible to prevent through hole corner crack and stripping of the through hole.