摘要 |
<p>Disclosed is a thermal conductive resin composition which enables to obtain a molded article having excellent thermal conductivity, electromagnetic shielding properties and the like. Also disclosed are a method for producing such a thermal conductive resin composition, and a housing. Specifically disclosed is a thermal conductive resin composition containing 40-94 volume% of a rubber-reinforced styrene resin [A], 5-55 volume% of a thermal conductive filler [B] and 1-20 volume% of an alloy and/or metal having a melting point of not more than 500˚C, wherein the volume ratio [B]/[C] is from 1/2 to 35/1. The composition may further contain a metal deactivation agent [D], thereby reducing smoke or the like during formation of a molded article or the like.</p> |
申请人 |
TECHNO POLYMER CO., LTD.;NIPPON KAGAKU YAKIN CO., LTD.;MATSUSAKA, KUNIO;KURIMOTO, HIDEYUKI;FUJIOKA, SHINSUKE;MATSUKAWA, KIYOTAKA;ISHIHARA, KOZO;KAMIYAHATA, TSUNEO;INADA, YOSHIKAZU |
发明人 |
MATSUSAKA, KUNIO;KURIMOTO, HIDEYUKI;FUJIOKA, SHINSUKE;MATSUKAWA, KIYOTAKA;ISHIHARA, KOZO;KAMIYAHATA, TSUNEO;INADA, YOSHIKAZU |