发明名称 THERMAL CONDUCTIVE RESIN COMPOSITION, METHOD FOR PRODUCING SAME AND HOUSING
摘要 <p>Disclosed is a thermal conductive resin composition which enables to obtain a molded article having excellent thermal conductivity, electromagnetic shielding properties and the like. Also disclosed are a method for producing such a thermal conductive resin composition, and a housing. Specifically disclosed is a thermal conductive resin composition containing 40-94 volume% of a rubber-reinforced styrene resin [A], 5-55 volume% of a thermal conductive filler [B] and 1-20 volume% of an alloy and/or metal having a melting point of not more than 500&ring;C, wherein the volume ratio [B]/[C] is from 1/2 to 35/1. The composition may further contain a metal deactivation agent [D], thereby reducing smoke or the like during formation of a molded article or the like.</p>
申请公布号 WO2005111146(A1) 申请公布日期 2005.11.24
申请号 WO2005JP08998 申请日期 2005.05.17
申请人 TECHNO POLYMER CO., LTD.;NIPPON KAGAKU YAKIN CO., LTD.;MATSUSAKA, KUNIO;KURIMOTO, HIDEYUKI;FUJIOKA, SHINSUKE;MATSUKAWA, KIYOTAKA;ISHIHARA, KOZO;KAMIYAHATA, TSUNEO;INADA, YOSHIKAZU 发明人 MATSUSAKA, KUNIO;KURIMOTO, HIDEYUKI;FUJIOKA, SHINSUKE;MATSUKAWA, KIYOTAKA;ISHIHARA, KOZO;KAMIYAHATA, TSUNEO;INADA, YOSHIKAZU
分类号 C08J3/20;C08K3/00;C08L51/04;C08L69/00;(IPC1-7):C08L51/04 主分类号 C08J3/20
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