| 摘要 |
A slip ring platter for a contacting ring system comprising:
a printed circuit board (PCB) with a first and a second side
a first plurality of concentric spaced conductive rings located on the first side of the PCB,
a first and a second feedline routed internally within the PCB,
a ground plane located on the second side of the first PCB, wherein the first feedline is coupled to a first of the concentric spaced conductive rings through a first conductive via and the second feedline is coupled to a second of the concentric spaced conductive rings through a second conductive via. |
