| 摘要 |
To provide an electronic circuit unit capable both of effectively radiating heat generated from a BCB resin layer and of readily connecting to the ground of an external circuit. <??>An electronic circuit unit 1 comprises a base plate 2 made of metal, a BCB resin layer 3 provided on a surface of the base plate 2 and having through-holes 3a, a wiring pattern 4 provided on a surface of the BCB resin layer 3, and a plurality of circuit elements, such as a thin film capacitor 5, a thin film resistor 6, and bare chip semiconductors 7 and 8 connected to the wiring pattern 4, the bare chip semiconductors 7 and 8 being wire-bonded to the wiring pattern 4. The bare chip semiconductor 7, which is a heating element, is directly connected to the metal base plate 2 via the through-hole 3a in the BCB resin layer 3. <IMAGE> |
