| 摘要 |
A heat collector ( 50 ) is formed by at least one extruding step for reducing machining steps, and is assembled to a separately formed mounting frame ( 40 ) which may be stamped and formed or molded. The heat collector has flanges ( 53 ) which bear against retaining tabs ( 45 ) formed on the mounting frame, and may be held by solder, glue, or mechanical means. The heat collector may receive a heat dissipator ( 18 ), or may be formed as a heat sink ( 56 ) such as a pin-fin type heat sink. The mounting frame can be fixed to a printed circuit board or the like having a component such as a central processing unit which contacts the collector in order to cool the unit.
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