| 摘要 |
A semiconductor device is manufactured by sealing a semiconductor chip, which is mounted on a prescribed support such as a lead frame, support bars, and a substrate connected with electrical wiring, in a package. Herein, individual information containing management information representing manufacturing conditions of semiconductor chips and test information representing results of testing of semiconductor chips is automatically recorded on a prescribed position of the prescribed support with respect to each of the semiconductor chips in synchronization with a die bonding process in response to the type of the package. That is, the individual information is recorded on exposed portions of outer leads, exposed portions of support bars, or the backside of the substrate, for example. This improves workability in reading and writing individual information without error, traceability to assure quality of semiconductor devices, and analysis of defects in semiconductor devices. |
