发明名称 |
METHOD FOR PRODUCTION OF ELECTRONIC CIRCUIT BOARD |
摘要 |
<p>A method for the deposition of a soldering powder to an electronic circuit board includes the steps of imparting stickiness to an exposed metal surface of a substrate and depositing a soldering powder to the resultant sticking part in a liquid body. The method can further include the steps of heating the substrate, thereby fusing the soldering powder, and forming a solder circuit.</p> |
申请公布号 |
WO2005109977(A1) |
申请公布日期 |
2005.11.17 |
申请号 |
WO2005JP08835 |
申请日期 |
2005.05.10 |
申请人 |
SHOWA DENKO K.K.;SAKAI, TAKEKAZU;SHOJI, TAKASHI |
发明人 |
SAKAI, TAKEKAZU;SHOJI, TAKASHI |
分类号 |
H05K3/34;(IPC1-7):H05K3/34 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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