发明名称 THERMOSETTING COMPOSITION AND METHOD FOR CURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting composition yielding a cured product with a combination of excellent electrical insulation, flexibility, adhesion and mechanical strength. SOLUTION: The thermosetting composition comprises (A) a compound having in the molecule at least one oxetanyl group, (B) a compound having in the molecule at least two carboxy groups and (C) an imidazolium salt. A method for during the composition is provided. A cured product obtained by the method is also provided. The cured product thus obtained is excellent in electrical insulation, flexibility, adhesion and mechanical strength. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005320518(A) 申请公布日期 2005.11.17
申请号 JP20050108110 申请日期 2005.04.05
申请人 SHOWA DENKO KK 发明人 KAMATA HIROTOSHI;KIMURA KAZUYA;UCHIDA HIROSHI
分类号 C08L101/06;C08K5/092;C08K5/3445;(IPC1-7):C08L101/06;C08K5/344 主分类号 C08L101/06
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