Method and apparatus for testing and diagnosing electrical paths through area array integrated circuits

摘要

A device for enabling testing electrical paths through an area array package of a circuit assembly is presented. The device may include a measurement access target on the area array package, wherein the measurement access target is connected to fill metal in the signal routing layers of the area array package. A method for testing continuity of electrical paths through an area array package of a circuit assembly is presented. In the method, one or more nodes of the circuit assembly are stimulated; a test probe is coupled to a measurement access target on the area array, where the measurement access target is connected to fill metal in the signal routing layers of the area array package; and an electrical characteristic is measured by a tester coupled to the test probe to determine continuity of electrical paths through the area array of the circuit assembly.