| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To suppress variations in the capacitance of a capacitor in a wiring board for a built-in capacitor and for its manufacturing method. <P>SOLUTION: The wiring board comprises a first electrode plate a second electrode plate which is formed opposite to the first one, and has an orthogonal projection onto the first electrode plate that falls within the plane of the first electrode plate; and a dielectric resin layer which is a plate material as a wiring board installed between the first and second electrode plates. The method of manufacturing the wiring includes board includes steps where: the electrode plate is formed in a fixed state on an insulation plate; the second electrode plate whose area is smaller or larger than that of the electrode plate is formed in a fixed state on the dielectric resin layer; and then the dielectric resin layer is stacked on the electrode plate formed on the insulation plate so that the opposite side from the second electrode plate-formed side may be in contact with the electrode plate formed on the insulation plate. The laminate thus obtained is so aligned that the orthogonal projection of the electrode plate on the second electrode plate externally capsulate the surface of the second electrode plate or falls within the plane of the second electrode plate. Thereafter, an interlayer connector to the electrode plates is formed. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
