| 摘要 |
PROBLEM TO BE SOLVED: To provide a silica-based material and film having a dielectric constant of 3.7 or below, a composition and a method for manufacturing and using the same. SOLUTION: A composition for preparing a silica-based material contains at least one silica source, a solvent, at least one porogen, optionally a catalyst, and optionally a flow additive. The solvent boils at a temperature ranging from 90°C and 170°C. The composition is selected from a group comprising compounds represented by chemical formulas HO-CHR<SP>8</SP>-CHR<SP>9</SP>-CH<SB>2</SB>-CHR<SP>10</SP>R<SP>11</SP>(wherein, R<SP>8</SP>, R<SP>9</SP>, R<SP>10</SP>and R<SP>11</SP>can independently be an alkyl group having from 1 to 4 carbon atoms or a hydrogen atom); and R<SP>12</SP>-CO-R<SP>13</SP>(wherein, R<SP>12</SP>is a hydrocarbon group having from 3 to 6 carbon atoms, R<SP>13</SP>is a hydrocarbon group having 1 to 3 carbon atoms), and mixtures thereof. COPYRIGHT: (C)2006,JPO&NCIPI
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