FORMATION OF AN INTERCONNECT STRUCTURE BY DECOMPOSING A PHOTOSENSITIVE DIELECTRIC LAYER
摘要
<p>The invention provides a method wherein a layer of photosensitive material is directly patterned. The photosensitive material is then at least partially decomposed to leave voids or air gaps in the layer to provide a low dielectric constant layer with reduced resistance capacitance delay characteristics.</p>
申请公布号
WO2005109490(A1)
申请公布日期
2005.11.17
申请号
WO2005US10919
申请日期
2005.03.31
申请人
INTEL CORPORATION;GOODNER, MICHAEL;O'BRIEN, KEVIN;KLOSTER, GRANT;MEAGLEY, ROBERT
发明人
GOODNER, MICHAEL;O'BRIEN, KEVIN;KLOSTER, GRANT;MEAGLEY, ROBERT