LEAD-FREE SOLDER MATERIAL, ELECTRONIC CIRCUIT BOARD AND THEIR PRODUCTION METHOD

摘要

PROBLEM TO BE SOLVED: To provide an improved Sn-Ag-Cu based lead-free solder material which can be suitably used as a joining material in the packaging process of an electronic component. SOLUTION: The lead-free solder material is obtained by adding particulates, preferably nanoparticles, containing elements substantially insoluble in an Sn-Ag-Cu based solder material to the Sn-Ag-Cu based solder material. The obtained lead-free solder material is used for soldering, so that the metallic structure of the joint part of the solder material can be made more fine. Particularly, the lead-free solder material is used as the joining material in the packaging process of an electronic component, thereby producing the electronic circuit board having high reliability characteristics. COPYRIGHT: (C)2006,JPO&NCIPI