| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a module comprising a built-in circuit component with which realizes highly reliable electrical connection between the upper and lower wiring patterns. <P>SOLUTION: In the manufacturing method of module comprising built-in circuit component, a via hole (120) is filled with a conductive paste (121) after the via hole (120) is formed to an electrical insulating sheet (101), a resin fluidity control unit (1) is formed by hardening the desired position of the electrical insulating sheet (101) and placing the first and second wiring boards (102, 103) to the upper and lower surfaces of the electrical insulating sheet (101), thereafter a circuit component (111) mounted to the second wiring board (103) is embedded to the electrical insulating sheet (101) with the heating and pressurizing processes using a hot press, and the desired wiring patterns (105, 108) of the first and second wiring boards (102, 103) are electrically connected with a via conductor (112) formed within the via hole (120). <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
