发明名称 |
Method and apparatus for decoupling conductive portions of a microelectronic device package |
摘要 |
A method and apparatus for decoupling conductive portions of a microelectronic device package. In one embodiment, the package can include a microelectronic substrate and a conductive member positioned at least proximate to the microelectronic substrate. The conductive member can have first and second neighboring conductive portions with at least a part of the first conductive portions spaced apart from a part of the neighboring second conductive portion to define an intermediate region between the first and second conductive portions. Each conductive portion has a bond region electrically coupled to the microelectronic substrate. A dielectric material is positioned adjacent to the first and second conductive portions in the intermediate region and has a dielectric constant of less than about 3.5.
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申请公布号 |
US2005250251(A1) |
申请公布日期 |
2005.11.10 |
申请号 |
US20030393376 |
申请日期 |
2003.03.19 |
申请人 |
CORISIS DAVID J;SCHOENFELD AARON M |
发明人 |
CORISIS DAVID J.;SCHOENFELD AARON M. |
分类号 |
H01L21/58;H01L23/31;H01L23/495;(IPC1-7):H01L21/58 |
主分类号 |
H01L21/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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