| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is used for sealing semiconductors, improves the adhesiveness of metal frame portions to heat-releasing plates, and can prevent the occurrence of release between the metal frame portions and the heat-releasing plates, when molded. SOLUTION: This epoxy resin composition which is useful for sealing semiconductors and is used for sealing the semiconductors excluding photo-semiconductors such as light-receiving elements and luminescent elements is characterized by comprising the following components (A) to (D), wherein the content of the component (D) is in the range of 75 to 95 wt.% based on the total amount of the epoxy resin composition. (A) An epoxy resin. (B) A phenolic resin. (C) A mold-releasing agent represented by general formula (1). (D) An inorganic filler. COPYRIGHT: (C)2006,JPO&NCIPI |
