发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND LEAD FRAME USED FOR IT
摘要 <P>PROBLEM TO BE SOLVED: To decrease a frequency for cleaning a resin molding mold. <P>SOLUTION: Forming a through-hole 1n at the outer side of a suspending lead 1e and a groove 1h so as to communicate with the through-hole 1n along the suspending lead 1e at its rear face side of a lead frame 1 can let out the air which flows in the through hole 1n through an air vent 9e, at the time of sealing resin injection to a cavity of a resin molding mold 9 from the through hole 1n by a resin injection pressure passing through the groove 1h to make the sealing resin easily enter into the through hole 1n to fill the sealing resin leaking to the air vent 9e in the through hole 1n. Therefore, the joint strength between the hardened sealing resin and the lead frame 1 in the vicinity of the air vent is strengthened to leave the sealing resin leaking to the air vent 9e in the lead frame side at the time of separation of the resin molding mold 9, and the mold is separated without the resin left in the air vent. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005317829(A) 申请公布日期 2005.11.10
申请号 JP20040135259 申请日期 2004.04.30
申请人 RENESAS TECHNOLOGY CORP 发明人 DANNO TADATOSHI
分类号 H01L23/50;H01L21/48;H01L21/56;H01L23/31;H01L23/495 主分类号 H01L23/50
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