| 摘要 |
A luminescent diode chip for flip-chip mounting on a carrier, having a conductive substrate ( 12 ), a semiconductor body ( 14 ) that contains a photon-emitting active zone and that is joined by an underside to the substrate ( 12 ), and a contact ( 18 ), disposed on a top side of the semiconductor body ( 14 ), for making an electrically conductive connection with the carrier ( 30 ) upon the flip-chip mounting of the chip, whereby either the carrier is solder covered or a layer of solder is applied to the contact. An insulating means ( 40, 42, 44, 46, 48 ) is provided on the chip, for electrically insulating free faces of the semiconductor body ( 14 ) and free surfaces of the substrate ( 12 ) from the solder.
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