Microphone esp. semiconductor capacitor microphone for use in mobile telephones and the like having space between chip and substrate in pressure communication with space between chip and cover

摘要

The microphone has a microphone chip (21) with a membrane structure and a counter-structure (61). These structures form a microphone capacitor whose capacitance is variable dependent on the detected sound. The microphone also has a substrate (11) and a cover (1) with a region which allows sound through. The cover is connected to the substrate such that the microphone chip can be received in the space between the substrate and the cover. A sound insulator surrounds the sound letting region of the cover and is arranged between the chip and the cover. At least one fastening device is provided for fastening the chip to the substrate. This is formed such that a space between the chip and the substrate is in pressure communication with a space between the chip and the cover. Independent claims also cover a method of manufacturing such a microphone.