<p>Disclosed is a pattern transfer method comprising a first step wherein a desired pattern is transferred to a resin layer (30) which is formed on a substrate (10) via a release layer (20); a following second step wherein the pattern having been transferred to the resin layer (30) is then transferred to the substrate (10) and a part of the release layer (20) is exposed; and a following third step wherein the release layer (20) between the substrate (10) and the resin layer (30) is removed by being dissolved through the exposed part.</p>
