发明名称 METHOD FOR PRODUCING CONDUCTIVE RESIN CURED PRODUCT AND COMPOSITION FOR CONDUCTIVE RESIN CURED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a conductive resin cured product improving adhesiveness of a substrate and a layer adjacently provided, usable even in an apparatus containing an element easily damaged with water and using various binder resins, to provide a method for producing the same and a composition for the conductive resin cured product. SOLUTION: The method for producing the conductive resin cured product comprises a preparing step of preparing a composition for the conductive resin cured product containing a hydrophilic group-containing polymer having a plurality of hydrophilic groups and an ionizing radiation curing or a thermosetting binder resin and an organic solvent and at least a part of the hydrophilic groups bound to lipophilic groups, a forming step of forming a coated film or a molded product from the composition for the conductive resin cured product, a drying step of drying the organic solvent contained in the coated film or molded product and a curing step of curing the coated film or molded product. The problems are solved by the method for production. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005314671(A) 申请公布日期 2005.11.10
申请号 JP20050090989 申请日期 2005.03.28
申请人 DAINIPPON PRINTING CO LTD 发明人 YOSHIHARA TOSHIO;HOJO MIKIKO;ITO KIYOSHI
分类号 C08L101/12;C08L65/00;(IPC1-7):C08L101/12 主分类号 C08L101/12
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