发明名称 |
METHOD FOR PRODUCING CONDUCTIVE RESIN CURED PRODUCT AND COMPOSITION FOR CONDUCTIVE RESIN CURED PRODUCT |
摘要 |
PROBLEM TO BE SOLVED: To provide a conductive resin cured product improving adhesiveness of a substrate and a layer adjacently provided, usable even in an apparatus containing an element easily damaged with water and using various binder resins, to provide a method for producing the same and a composition for the conductive resin cured product. SOLUTION: The method for producing the conductive resin cured product comprises a preparing step of preparing a composition for the conductive resin cured product containing a hydrophilic group-containing polymer having a plurality of hydrophilic groups and an ionizing radiation curing or a thermosetting binder resin and an organic solvent and at least a part of the hydrophilic groups bound to lipophilic groups, a forming step of forming a coated film or a molded product from the composition for the conductive resin cured product, a drying step of drying the organic solvent contained in the coated film or molded product and a curing step of curing the coated film or molded product. The problems are solved by the method for production. COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2005314671(A) |
申请公布日期 |
2005.11.10 |
申请号 |
JP20050090989 |
申请日期 |
2005.03.28 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
YOSHIHARA TOSHIO;HOJO MIKIKO;ITO KIYOSHI |
分类号 |
C08L101/12;C08L65/00;(IPC1-7):C08L101/12 |
主分类号 |
C08L101/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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