| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide module parts with a small camber realizing sufficient shielding effect, without increasing the manufacturing processes and holding bending grade. <P>SOLUTION: There are provided module parts which form electric shield, corresponding to desired circuit blocks by mounting on a substrate 11 packaging parts 12 and a partition 13, having conductivity for dividing the parts into the desired circuit blocks, and providing a seal 14 at a portion where this partition 13 is not formed, and providing a conductive film 16 on the front surface of this seal 14. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
