| 摘要 |
PROBLEM TO BE SOLVED: To provide a brazing material for a ceramic substrate capable of averaging an uneven surface of a layer of a brazing material and controlling spread of the layer of the brazing material and improving a linearity of an outer edge of the layer of the brazing material and preventing liquation of Cu contained in the brazing material, and to provide a ceramic circuit board using the same. SOLUTION: The brazing material is provided to join a metal plate at least on one surface of the ceramic substrate via the layer of the brazing material, and is used for the ceramic circuit board forming designated patterns by means of etching of the metal plate. In the brazing material, 5 to 30 mass% of powdered Ag with average diameters of articles of 1 to 15μm is added to powdered alloy with average diameters of particles of 15 to 40μm comprising 55 to 85 mass% of Ag, 5 to 25 mass% of In, 0.2 to 2.0 mass% of Ti, reminder Cu, and inevitable impurities. The ceramic substrate has Rmax of 5 to 50μm or less on an outer edge of a projected portion of the brazed material, an undulation of 10 to 100μm or less on a boundary line of the outer edge, and a remaining rate of 80% or more for the layer of the brazing material on the projected portion. COPYRIGHT: (C)2005,JPO&NCIPI |
